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SS-241 R5
AHA 1/24/07
Ceramic Chip Capacitors Type X5R
1. General General purpose dielectric for ceramic capacitors EIA class ll dielectric Temperature variation of capacitance is within 15% from -55C to +85C Well suited for decoupling and filtering applications Available in high capacitance values (up to 100 F)
CERTIFIED
CERTIFIED
2. Dimensions
L W t
Table 1
Case Size 0402 0603 L .039.004 (1.00.1) .063.006 (1.60.15) .079.008 (2.010.2) .126.008 (3.20.2) .126.008 (3.20.2)
Dimensions in inches (mm)
Dimensions inches (mm) W t (Max.) .02.004 (0.50.1) .032.006 (0.810.15) .049.008 (1.250.2) .063.008 (1.60.2) .098.008 (2.50.2) .021 (0.55) .035 (0.9) .051 (1.3) .059 (1.5) .067 (1.7) d .01.006 (0.250.15) .014.006 (0.350.15) .02.01 (0.500.25) .02.01 (0.50.25) .02.01 (0.50.25)
d Ceramic Body
d
0805 1206
Solder Plating (Sn) Ni Plating
1210
Electrodes
Silver Metallization
3. Type Designation The type designation shall be the following form:
X5R
Dielectric
0805
Size
0402 0603 0805 1206 1210
A
Voltage
K = 6.3V A = 10V C = 16V
T
Termination
TD
Packaging
TP: 7" 2mm pitch (0402 only) TD: 7" Paper tape TE: 7" Embossed plastic TDB: 13" Paper tape TEB: 13" Embossed plastic
225
Capacitance Code
2 significant digits + no. of zeros.
K
Capacitance Tolerance
K: 10%
T: Sn
PAGE 1 OF 8 Bolivar Drive
P.O. Box 547
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SS-241 R5
4. X5R Dielectric Capacitance Range
Size Capacitance values pF F
100 150 220 330 470 680 1000 1200 1500 1800 2200 2700 3300 3900 4700 5600 6800 8200 0.010 0.012 0.015 0.018 0.022 0.027 0.033 0.039 0.047 0.056 0.068 0.082 0.10 0.12 0.15 0.18 0.22 0.27 0.33 0.47 0.56 0.68 0.82 1.0 1.2 1.5 1.8 2.2 3.3 4.7 6.8 10 22 47 100
Available sizes are shaded.
0603 0805 25 (E) 6.3 (K) 10 (A) 16 (C) 25 (E) 6.3 (K) 1206 10 (A) 16 (C) 25 (E) 1210 6.3 (K) 10 (A)
0402 6.3 (K) 10 (A) 16 (C) 6.3 (K)
10 (A)
16 (C)
Capacitance tolerance available: 10%
PAGE 2 OF 8 Bolivar Drive
P.O. Box 547
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USA
814-362-5536
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SS-241 R5
5. Characteristics
Item Operating Temperature Range Capacitance Dissipation Factor Requirement -55C to +85C Within specified tolerance 2.5% for 50V DC rating 5.0% for 10V DC rating 100,000 M or 500 M - F, whichever is less No breakdown or visual defects Frequency: 1.0 kHz 10% Voltage: 1.0 Vrms .2 V For Cap > 10 F, 0.5 Vrms @ 120 Hz Charge device with rated voltage for 60 5 secs @ room temp/humidity Charge device with 300% of rated voltage for 1-5 seconds, w/charge and discharge current limited to 50 mA (max) Deflection: 1 mm Test Time: 30 seconds Test Methods Temperature cycle chamber
Insulation Resistance Dielectric Strength Resistance to Flexure Stresses
Appearance Capacitance Variation Dissipation Factor Insulation Resistance
No defects 10% Meets initial values Initial Value x 0.3
90 mm
Solderability Resistance to Solder Heat
95% of each terminal should be covered with fresh solder Appearance
Dip device in eutectic solder at 230 5C for 5.0 0.5 seconds
No defects, < 25% leaching of either end terminal Dip device in eutectic solder at 260C for Capacitance Variation 7.5% 60 seconds. Store at room temperature for 24 2 hours before measuring Dissipation Factor Meets initial values electrical properties Insulation Resistance Meets initial values Dielectric Strength Meets initial values No visual defects 7.5% Meets initial values Meets initial values Meets initial values Step 1: -55C 2 Step 2: Room temp Step 3: +85C 2 Step 4: Room temp 30 3 minutes 3 minutes 30 3 minutes 3 minutes
Thermal Shock
Appearance Capacitance Variation Dissipation Factor Insulation Resistance Dielectric Strength
Repeat for 5 cycles and measure after 24 2 hours at room temperature
PAGE 3 OF 8 Bolivar Drive
P.O. Box 547
Bradford, PA 16701
USA
814-362-5536
Fax 814-362-8883
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SS-241 R5
5. Characteristics (continued)
Item Load Life Requirement Appearance Capacitance Variation Dissipation Factor Insulation Resistance Dielectric Strength Load Humidity Appearance Capacitance Variation Dissipation Factor Insulation Resistance Dielectric Strength No visual defects 12.5% Initial value x 2.0 Initial value x 0.3 Meets initial values No visual defects 12.5% Initial value x 2.0 Initial value x 0.3 Meets initial values Test Methods Charge device with twice rated voltage in test chamber set at 85C 2C for 1000 hours (+48, -0) Remove from test chamber and stabilize at room temp. and humidity for 24 2 hours before measuring Store in a test chamber set at 85C 2C/ 85% 5% relative humidity for 1000 hours (+48, -0) with rated voltage applied Remove from chamber and stabilize at room temp. and humidity for 24 2 hours before measuring
6. Typical Impedance Characteristics
X5R - Temperature Coefficient
+20 +15 +10 +5 0 -5 -10 -15 -20 -60 -40 -20 0 +20 +40 +60 +80 100 +20 +25 +40 +60 +80 +100 1000
Insulation Resistance vs Temp.
10000
Temperature (C)
Temperature (C)
PAGE 4 OF 8 Bolivar Drive
P.O. Box 547
Bradford, PA 16701
USA
814-362-5536
Fax 814-362-8883
www.koaspeer.com
Spec if ica tions giv en h erein m ay be c hanged at any tim e wit hout prior notic e. Pleas e c onf irm tec hnic al s pecif icat ions bef ore y ou order a nd/or use .
SS-241 R5
7. Tape and Reel Quantities All tape and reel specifications are in compliance with RS481.
Size Dielectric Voltage Cap. Range TP TD TE TDB TEB
0402 0603 0805 1206 1210
All All X5R X5R X5R
All All All All 10
All All All All 106 ~ 226
10000 --- --- --- ---
--- 4000 --- --- ---
--- --- 3000 2000 2000
--- 15000 --- --- ---
--- --- --- --- ---
* TP is a 7" reel with a 2mm pitch, TD & TE are 7" reels, TDB & TEB are 13" reels
8. Reel Dimensions
1.575 (40) min. Access hole at slot location. W3 (Includes flange distortion at outer edge). W2 (Measured at hub). B* (Arbor hole dia.) C
A
D*
N (Hub dia.)
Full radius*
W1 (Measured at hub).
* Drive spokes optional. If used, asterisked dimensions apply.
T ape slot in core for tape start. 0.98 (2.5) min. width, .394 (10) min. depth.
Dimensions in inches (mm) D* Min. N Min. W1 .331 - 0.0 (8.4 1.0 ) - 0.0 .488 - 0.0 (12.4 2.0 ) - 0.0
.076 .060
Tape Size(1) 8mm
A Max.
B* Min.
C
W2 Max. .567 14.4 .724 (18.4)
W3 .311 (7.9 Min.) .429 (10.9 Max.) .469 (11.9 Min.) .607 (15.4 Max.)
12.992 (330) 12mm
0.059 (1.5)
0.512 0.008 (13.0 0.20)
.795 (20.2)
1.969 (50)
Metric dimensions will govern. English measurements rounded and for reference only. (1) For tape sizes 16mm and 24mm (used with chip size 3640) consult EIA RS-481 latest revision. Bolivar Drive
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P.O. Box 547
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Fax 814-362-8883
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SS-241 R5
9. Carrier Tape Specifications
Embossed plastic 8 & 12mm
T2 T Deformation between embossments Top cover tape
10 pitches cumulative tolerance on tape 0.008 (0.2) D0 P2
P0 Embossment E G1 See note 3
A0 F B0 W
B1
K0
G2 See note 4
T1 For tape feeder reference only including draft concentric around B0 Center lines of cavity User direction of feed
P1 Maximum cavity size, see note 1 D1 for components .079 x .047 (2.0 x 1.2) and larger
Dimensions in inches (mm) T Max. .024 (0.600) T1 .004 (0.10) Max. G1 .030 (0.75) Min. See note 3 G2 .030 (0.75) Min. See note 4
Tape Size Constant 8mm and 12mm Tape Size Variable 8mm 12mm 12mm 1/2 Pitch 12mm Double Pitch
D0 .059 (1.5
.004 0.0 0.10 0.0
E .069 .004 ) (1.75 0.10)
P0
P2
.157 .004 .079 .002 (4.0 0.10) (2.0 0.05)
B1 Max. See note 6 .179 (4.55) .323 (8.2) .179 (4.55) .323 (8.2)
D1 Min. See note 5 .039 (1.0) .059 (1.5) .039 (1.0) .059 (1.5)
F
P1
R Min. See note 2 .984 (25) 1.181 (30) .984 (25) 1.181 (30)
T2 .098 (2.5 Max.) .256 (6.5 Max.) .098 (2.5 Max.) .256 (6.5 Max.)
W .315 (8.0
.012 .004 0.3 0.1
A0B0K0 ) See note 1
.138 .002 .157 .004 (3.5 0.05) (4.0 0.10) .217 .002 .157 .004 (5.5 0.05) (4.0 0.10) .138 .002 .079 .004 (3.5 0.05) (2.0 0.10) .217 .002 .315 .004 (5.5 0.05) (8.0 0.10)
.472 .012 See note 1 (12.0 .30) .315 .012 - .004 (8.0 0.3 ) - 0.1 See note 1
.472 .012 See note 1 (12.0 .30)
Notes: 1. A0, B0 and K0 are determined by the max. dimensions to the ends of the terminals extending from the components body and/or the body of the component. The clearance between the end of the terminals of the body of the components to the sides and depth of the cavity (A0, B0 and K0) must be within .002" (0.05)mm min. and .020" (0.50)mm max. The clearance allowed must also prevent rotation of the component within the cavity of not more than 20 degrees (see examples A & B). 2. Tape with components shall pass around radius "R" without damage. The minimum trailer length (Note 2 Fig. 3) may require additional length to provide R min. for .472" (12)mm embossed tape for reels with hub diameters approaching N min. (Table 4). 3. G1 dimension is the flat area from the edge of the sprocket hole to either the outward deformation of the carrier tape between the embossed cavities or to the edge of the cavity whichever is less. 4. G2 dimension is the flat area from the edge of the carrier tape opposite the sprocket holes to either the outward deformation of the carrier tape between the embossed cavity or to the edge of the cavity whichever is less.
PAGE 6 OF 8 Bolivar Drive
P.O. Box 547
Bradford, PA 16701
USA
814-362-5536
Fax 814-362-8883
www.koaspeer.com
Spec if ica tions giv en h erein m ay be c hanged at any tim e wit hout prior notic e. Pleas e c onf irm tec hnic al s pecif icat ions bef ore y ou order a nd/or use .
SS-241 R5
9. Carrier Tape Specifications (continued)
Embossed plastic 8 & 12mm
Notes: 5. The embossed hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 20 Maximum Component Rotation 6. B1 dimension is a reference dimension for tape feeder clearance only.
20 Maximum Component Rotation Side or Front Sectional View Example "A"
BO
Typical component cavity center line
AO
Typical component center line
T View Example "B" op
10. Carrier Tape Specifications
Punched paper tape 8 & 12mm
T
10 pitches cumulative tolerance on tape 0.008 (0.2) D0 P2
P0
E F W B0 G1 P1 Center lines of cavity
Bottom cover tape
Top cover tape
T1 T1
Cavity size, see note 1
A0
G2
User direction of feed
Dimensions in inches (mm) T1
.004 (0.10) Max.
Tape Size Constant 8mm and 12mm Tape Size Variable 8mm 12mm 8mm 1/2 Pitch 12mm Double Pitch
D0
.059
.004 - .000
E
.069 .004 (1.75 0.10)
P0
.157 .004 (4.0 0.10)
P2
.079 .002 (2.0 0.05)
G1
.030 (0.75) Min.
G2
.030 (0.75) Min.
R MIN
.984 (25) See note 2
(1.5 0.1 ) - 0.0
P1
.157 .004 (4.0 0.10) .157 .004 (4.0 .010) .079 .004 (2.0 0.10) .315 .004 (8.0 .010)
F
.138 .002 (3.5 0.05) .217 .002 (5.5 0.05) .138 .002 (3.5 0.05) .217 .002 (5.5 0.05)
W
.315 .012 - .004 (8.0 0.3 ) - 0.1 .472 .012 (12.0 0.3) .315 (8.0
.012 - .004 0.3) - 0.1
A0B0
T
See note 1
See note 3
.472 .012 (12.0 0.3)
PAGE 7 OF 8 Bolivar Drive
P.O. Box 547
Bradford, PA 16701
USA
814-362-5536
Fax 814-362-8883
www.koaspeer.com
Spec if ica tions giv en h erein m ay be c hanged at any tim e wit hout prior notic e. Pleas e c onf irm tec hnic al s pecif icat ions bef ore y ou order a nd/or use .
SS-241 R5
10. Carrier Tape Specifications (continued)
Punched paper tape 8 & 12mm
Notes: 1. A0, B0 and T are determined by the max. dimensions to the ends of the terminals extending from the component body and/or the body dimensions of the component. The clearance between the ends of the terminals or body of the components to the sides and depth of the cavity (A0, B0 and T) must be within .002" (0.05) mm min. and .020" (0.50) mm max. The clearance allowed must also prevent rotation of the component 20 Maximum Component Rotation within the cavity of not more than 20 degrees (see examples C & D). 20 Maximum Component Rotation 2. Tape with components shall pass Typical component around radius "R" without damage. cavity center line T B O Typical component 3. .043" (1.1) mm base tape and 20 cavity center line T BO .063" (1.6) mm max. for 20 non-paper base compositions. Maximum Component Rotation
Maximum Componentor Front Sectional View Side Rotation Side or Front Sectional Example "C" View Example "C" Typical component center Typical component line AO center line AO Top View Example "D" Top View Example "D"
11. Recommended Land Pattern Dimensions
Component pads should be designed to achieve good solder filets and minimize component movement during reflow soldering. Pad dimensions are given below for multilayer ceramic capacitors for both reflow and wave soldering. The basis for these designs is: * Pad width equal to component width. It is permissible to decrease this to as low as 85% of component width but it is not advisable to go below this. * Pad overlap 0.5mm beneath component * Pad extension 0.5mm beyond components for reflow and 1.0mm for wave soldering Dimensions inches (mm)
C D C A B
Case Size 0402 0603 0805 1206 1210
A 0.02 (0.50) 0.03 (0.75) 0.05 (1.25) 0.06 (1.60) 0.10 (2.50)
B 0.07 (1.70) 0.09 (2.30) 0.12 (3.00) 0.16 (4.00) 0.16 (4.00)
C 0.02 (0.60) 0.03 (0.80) 0.04 (1.00) 0.04 (1.00) 0.04 (1.00)
D 0.02 (0.50) 0.03 (0.70) 0.04 (1.00) 0.09 (2.00) 0.09 (2.00)
PAGE 8 OF 8 Bolivar Drive
P.O. Box 547
Bradford, PA 16701
USA
814-362-5536
Fax 814-362-8883
www.koaspeer.com
Spec if ica tions giv en h erein m ay be c hanged at any tim e wit hout prior notic e. Pleas e c onf irm tec hnic al s pecif icat ions bef ore y ou order a nd/or use .

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